logo
Главная страница Продукцияпусковая площадка восходящего потока теплого воздуха силикона

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management

Подробная информация о продукте:
Место происхождения: Китай
Фирменное наименование: Ziitek
Сертификация: UL and RoHs
Номер модели: ТИФ100-15-01Ф
Документ: TIF100-15-01F_Data Sheet.pdf
Оплата и доставка Условия:
Количество мин заказа: 1000 шт.
Цена: 0.1-10 USD/PCS
Упаковывая детали: Коробка 24*13*12 см
Время доставки: 3-8 рабочих дней
Условия оплаты: Т/Т
Поставка способности: 100000 шт/месяц
контакт
Подробное описание продукта
Название продукта: Наполнитель теплового зазора, обеспечивающий теплопроводность 1,5 Вт/мК для управления теплом в элек термальное проводное: 1,5 Вт/мк
Приложение: Для управления теплом электронных устройств Твердость: 65/60 Шор 00
образец: Бесплатный образец Цвет: Черный
Толщина: 0,010 "(0,25 мм) ~ 0,200" (5,0 мм) Плотность: 2,3 г/см³
Ключевые слова: Наполнитель теплового зазора Строительство: Силиконовый эластомер с керамическим наполнением

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management


Company Profile 


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material,  thermal grease etc. UL94 V-0, SGS and ROHS are compliant. 


Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description


The TIF®100-15-01F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fillinterfacegaps,transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation,
and mechanical stability.


Features 

> Good thermal conductive 6.5W/mK
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> RoHS compliant
> UL recognize

Applications 

> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU
> Display card
> Mainboard/mother board
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Key attributes 


Typical Properties of TIF®100-15-01F Series
Property Value Test method
Color Black Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness (Shore 00) 65 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 1.5 ASTM D5470
1.5 ISO22007

 

Product Specifications 


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Thermal Gap Filler Offering Thermal Conductivity 1.5W/mK For In Electronic Device Heat Management 1


Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1


Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ 

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q:How can we get detailed price list? 

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity. 


Q: What kind of packaging you offer? 

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery. 


Q:Do big buyers have promotional prices? 

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices. 

Контактная информация
Dongguan Ziitek Electronical Material and Technology Ltd.

Контактное лицо: Dana Dai

Телефон: +86 18153789196

Оставьте вашу заявку (0 / 3000)

Другие продукты