Name: Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: ТИФ700ПУС
Price: 4.10 USD
Availability: InStock

Главная страница Продукция пусковая площадка восходящего потока теплого воздуха силикона

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Подробная информация о продукте:

Место происхождения:	Китай
Фирменное наименование:	Ziitek
Сертификация:	UL & RoHS
Номер модели:	ТИФ700ПУС

Оплата и доставка Условия:

Количество мин заказа:	1000 шт.
Цена:	0.1-10 USD/PCS
Упаковывая детали:	Коробки 242312 см
Время доставки:	3-5 рабочих дней
Условия оплаты:	Т/Т
Поставка способности:	1000000 ПК/месяц

контакт

Подробное описание продукта

Название продуктов:	Хорошая теплоотдача Ультра мягкая силиконовая термальная подушка 7,5 Вт для серверов AI процессоров	Строительство:	Керамический силиконовый эластомер
Приложение:	AI-серверы AI-процессоры	Диапазон толщины:	0,5-5,0 ммТ
Пожарный рейтинг:	UL94 V-0	Диэлектрическая постоянная @ 1 МГц:	4.5
Цвет:	Серый	Теплопроводность:	7.5 Вт/м-К
Напряжение пробоя (В/мм)）:	≥5500	Ключевые слова:	пусковая площадка силикона термальная

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity:7.5 W/mK

> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations

> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

Typical Properties of TIF^®700PUS Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.2		ASTM D792
Thickness Range(inch/mm)	0.020~0.030 (0.50~0.5)	0.040~0.200 (1.0~5.0)	ASTM D374
Hardness (Shore OO)	70	20	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.5 MHz		ASTM D150
Volume Resistivity	＞3.5 X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	7.5 W/m-K		ASTM D5470
	7.5 W/m-K		ISO22007

Product Specifications

Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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