Name: Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: ТИФ100-32-05У
Price: 4.10 USD
Availability: InStock

Главная страница Продукция пусковая площадка восходящего потока теплого воздуха силикона

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Подробная информация о продукте:

Место происхождения:	Китай
Фирменное наименование:	Ziitek
Сертификация:	UL & RoHS
Номер модели:	ТИФ100-32-05У

Оплата и доставка Условия:

Количество мин заказа:	1000 шт.
Цена:	0.1-10 USD/PCS
Упаковывая детали:	Коробки 242312 см
Время доставки:	3-5 рабочих дней
Условия оплаты:	Т/Т
Поставка способности:	1000000 ПК/месяц

контакт

Подробное описание продукта

Название продуктов:	Ультрамягкая термосиликоновая прокладка 3,2 Вт, наполнитель зазора с высокой проводимостью для серве	Диапазон толщины:	0,25-5,0 ммТ
Приложение:	AI-серверы, охлаждение графического процессора, инвертор	Цвет:	Синий
Напряжение пробоя (В/мм)）:	≥5500	Строительство:	Керамический силиконовый эластомер
Пожарный рейтинг:	UL94 V-0	Теплопроводность:	3.2W/m-K
Диэлектрическая постоянная @ 1 МГц:	3.5	Ключевые слова:	Термически силиконовая прокладка

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.

Features:

> Good thermal conductivity: 3.2W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability

Applications

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

Typical Properties of TIF^®100-32-05U Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020 (0.25~0.5)	0.030~0.200 (0.75~5.0)	ASTM D374
Hardness (Shore OO)	65	27	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	3.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.2 W/m-K		ASTM D5470
	3.2 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010"(0.25 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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